
Location
浙江杭州灵隐路36-2号振鹭院
Time
04/25 周五 06:00 ~ 08:00
【芯片未来,封装与热管理展望】聚焦芯片封装技术革新,揭秘AI芯片热管理挑战!本次活动将深度探讨先进封装技术如何重塑芯片格局,以及高效热管理方案如何为AI芯片保驾护航。特邀行业大咖共话芯片技术新未来。从材料革新到工艺升级,从散热策略到系统优化,全方位解析芯片封装与热管理的最新趋势与解决方案。

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